Integrated Circuit | Packaging Process.

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Internal Circuit Packaging Process of 8086Microprocessor:

Introduction:

Internal circuit packaging of microprocessor semiconductors deals with the study, assembly, and structuring of the printed-circuit-board, programming, and diagramming of the circuits found in the inner part of the microprocessor which plays a vital role in the functioning of the microprocessor and protects the devices from damage. Integrated circuit packaging is also named as integrated housing of the semi-conductors, ICs, Diodes, resistors, conductors, and sub chips. The internal circuit of the microprocessor includes:

      Single in-line pins

       Dual in-line pins

·         Through-hole technology

·         Surface-mount technology

·         Chip carrier

·         Pin grid array

·         Flat package

·         Small outline integrated circuit

·         Chip scale package

·         Ball grid array

·         Transistor, Diode, small pin count IC packages

·         Multi-chip packages.

Integrated Circuit Packaging- Dual row

Family	Pin	Name
DIP	Y	Dual inline package
LFCSP	N	Lead-frame chip-scale package
MSOP	Y	Mini small-outline package
SO SOIC SOP	Y	Small-outline integrated circuit
SOT	Y	Small-outline transistor
SSOP	Y	Shrink small-outline package
TDFN	N	Thin dual flat no-lead
TSOP	Y	Thin small-outline package
TSSOP	Y	Think shrink-small outline package
uSOP	Y	Micro small-outline package
US8	Y	US8 package
PLCC	N	Plastic leaded chip-carrier
CLCC	N	Ceramic leadless chip-carrier
LQFP	Y	Low-profile quad flat package
TQFP	Y	Thin quad flat-package
TQFN	N	Thin quad flat no-lead

The families and names mentioned in the table above are the types of the integrated circuit packages. They are all nowadays are acceptable and ever-used types with different dimensions and tolerances. And they are all the registered types with the trade industry like JEDEC and Pro-electron.

In different technologies, they are connected in different ways and are assembled in the circuit boards in different ways.

 

The pin grid array at the bottom of an XC68020 microprocessor is shown in the picture below:

4000-series logic ICs in 0.3 wide 14-pin plastic DIP packages (DIP-14N), also known as PDIP (Plastic DIP) is shown in the picture below:

 

Early USSR-made integrated circuit. The tiny block of semiconducting material (the “die”), is enclosed inside the round, metallic case (the “package”).